CyberOptics Corporation has announced that it recently received orders valued at $4.2 million for its 3D MX3000 memory module inspection systems for multiple subcontractors of a large memory manufacturer.
The MX3000 is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS Sensors delivering simultaneous dual-sided automated final vision inspection for singulated memory modules – for metrology grade accuracy at production speed. The system provides in-line defect review stations and auto sorts false calls into good trays after review, is fully automation-ready, SECS/GEM and S2/S8 compliant. In-line multiple module grippers minimize handing tact time, and autoconversion supports various memory module form factors including RDIMM, SODIMM, VLPDIMM, UDIMM.
MRS technology suppresses any reflections that can distort the data, especially on shiny components, enabling precise 3D representation while the architecturally superior sensor design captures and transmits data simultaneously and in parallel. The result is unmatched speed and accuracy. The company stated that it believes these large orders affirm the importance of its 3D MRS technology based MX3000 inspection systems for memory manufacturers.
“Our MRS sensor technology is widely used in SMT, semiconductor and other challenging applications for inspection and metrology,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics, at product launch. “
We have now integrated the 3D technology into our memory module inspection systems to deliver an unparalleled combination of high resolution, high accuracy and high speed. Ultimately, we’re enabling yield and productivity improvements for our customers.”
For more information:
www.cyberoptics.com
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